ChongMing Group (HK) Int'l Co., Ltd
CHONGMING GROUP (HK) INT'L CO., LTD.
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. . . employing the Schottky Barrier principle in a metal−to−silicon power rectifier. Features epitaxial construction with oxide passivation and metal overlay contact. Ideally suited for low voltage, high frequency switching power supplies; free wheeling diodes and polarity protection diodes.
• Compact Package with J−Bend Leads Ideal for Automated Handling
• Highly Stable Oxide Passivated Junction
• Guardring for Over−Voltage Protection
• Low Forward Voltage Drop
• Pb−Free Package May be Available. The G−Suffix Denotes a Pb−Free Lead Finish
Mechanical Characteristics:
• Case: Molded Epoxy
• Epoxy Meets UL94, VO at 1/8″
• Weight: 95 mg (approximately)
• Maximum Temperature of 260°C / 10 Seconds for Soldering
• Cathode Polarity Band
• Available in 12 mm Tape, 2500 Units per 13 inch Reel, Add “T3” Suffix to Part Number
• Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable
• Marking: BKJL
STOCK LIST
| TPS2110APWR | 6076 | TI | 16+ | TSSOP-8 |
| TPS2111PWR | 2972 | TI | 04+ | TSSOP-8 |
| TPS7233QP | 10800 | TI | 16+ | TSSOP-8 |
| SI6435DQ | 18024 | VISHAY | 13+ | TSSOP-8 |
| W9425G6JH-5 | 23316 | WINBOND | 16+ | TSSOP-66 |
| THC63LVDF84B | 26760 | THINE | 15+ | TSSOP-56 |
| SN74AVC20T245DGGR | 2855 | TI | 16+ | TSSOP-56 |
| THC63LVDF64A-G | 8798 | THINE | 16+ | TSSOP-48 |
| SN74AHC16244DGGR | 18073 | TI | 16+ | TSSOP-48 |
| SN74ALVC164245DGGR | 12332 | TI | 14+ | TSSOP-48 |
| SN74AVC16T245DGGR | 27180 | TI | 11+ | TSSOP-48 |
| SN74CBTD16210DGGR | 45672 | TI | 16+ | TSSOP-48 |
| SN74LVCH16T245DGGR | 18472 | TI | 16+ | TSSOP-48 |
| SN74LVTH16244ADGGR | 10252 | TI | 10+ | TSSOP-48 |
| SN75LVDS84DGGR | 2081 | TI | 02+ | TSSOP-48 |
| TB62254AFNG | 21265 | TOSHIBA | 14+ | TSSOP-48 |
| TPD12S521DBTR | 11104 | TI | 16+ | TSSOP-38 |
| TLV320AIC12KIDBTR | 6886 | TI | 16+ | TSSOP-30 |
| TPS5124DBTR | 5444 | TI | 07+ | TSSOP-30 |
| SN75C3243PWR | 9792 | TI | 10+ | TSSOP-28 |
| TLC5940PWPR | 6738 | TI | 15+ | TSSOP-28 |